The numerical simulation and optimization of PBGA package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of EPBGA by applying finite element analysis ANSYS 8.1. EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, subs...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10227285322289614271 |