Pick-up Process Analysis of Die Bonder
博士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === Thin die is the mainstream for the packages to achieve the goal of manufacturing compact and light products with higher functionality for customers. Gallium arsenide (GaAs) has some unique properties that make it ideal for using in applications that silicon i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62770622576977757063 |