Wire Sweep and Paddle Shift Modeling of IC Packages During Encapsulation Process
博士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === This thesis presents solutions to predict the wire sweep and paddle shift phenomenons occurring during the molding process. In the presented solution, the element number of mesh model is often between 500,000 ~ 1,000,000. For such large mesh model, the use...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79264595999509738184 |