The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals
碩士 === 國立成功大學 === 電機工程學系碩博士班 === 93 === Following the successful application of the Chemical Mechanical Polishing (CMP) by IBM in 1983, the semiconductor manufacture process has been promoted to a new regime. Then the CMP becomes an very importance technology in ULSI manufacture soon and pushes th...
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2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11179780674022667028 |
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ndltd-TW-093NCKU54420672017-06-11T04:32:55Z http://ndltd.ncl.edu.tw/handle/11179780674022667028 The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals 化學機械研磨(CMP)應用在不同絕緣層與金屬層終點偵測技術的研究 Kuo-Lang Sun 孫國郎 碩士 國立成功大學 電機工程學系碩博士班 93 Following the successful application of the Chemical Mechanical Polishing (CMP) by IBM in 1983, the semiconductor manufacture process has been promoted to a new regime. Then the CMP becomes an very importance technology in ULSI manufacture soon and pushes the technology feature of IC process from 0.25 um to 0.13 um and even down to 90 nm during a short time of several years. Global Planarization is the most feature of CMP process and depends on the precisely controlling of endpoint seriously. In this thesis, the design and mechanism of various endpoint detection systems applied for dielectrics and metals have been studied in detail and evidenced experimentally. Yean-Kuen Fang 方炎坤 2005 學位論文 ; thesis 95 zh-TW |
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NDLTD |
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zh-TW |
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Others
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NDLTD |
| description |
碩士 === 國立成功大學 === 電機工程學系碩博士班 === 93 === Following the successful application of the Chemical Mechanical Polishing (CMP) by IBM in 1983, the semiconductor manufacture process has been promoted to a new regime. Then the CMP becomes an very importance technology in ULSI manufacture soon and pushes the technology feature of IC process from 0.25 um to 0.13 um and even down to 90 nm during a short time of several years.
Global Planarization is the most feature of CMP process and depends on the precisely controlling of endpoint seriously.
In this thesis, the design and mechanism of various endpoint detection systems applied for dielectrics and metals have been studied in detail and evidenced experimentally.
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| author2 |
Yean-Kuen Fang |
| author_facet |
Yean-Kuen Fang Kuo-Lang Sun 孫國郎 |
| author |
Kuo-Lang Sun 孫國郎 |
| spellingShingle |
Kuo-Lang Sun 孫國郎 The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals |
| author_sort |
Kuo-Lang Sun |
| title |
The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals |
| title_short |
The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals |
| title_full |
The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals |
| title_fullStr |
The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals |
| title_full_unstemmed |
The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals |
| title_sort |
study of cmp endpoint detection technology for various dielectrics and metals |
| publishDate |
2005 |
| url |
http://ndltd.ncl.edu.tw/handle/11179780674022667028 |
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