The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals
碩士 === 國立成功大學 === 電機工程學系碩博士班 === 93 === Following the successful application of the Chemical Mechanical Polishing (CMP) by IBM in 1983, the semiconductor manufacture process has been promoted to a new regime. Then the CMP becomes an very importance technology in ULSI manufacture soon and pushes th...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11179780674022667028 |