Effect of Cu Seed Layer Surface Morphology on the Resistance of Via in Cu/low-k Multilevel interconnects
碩士 === 國立成功大學 === 微電子工程研究所碩博士班 === 93 === In this thesis, the target has been paid on study of the resistance change and the surface morphology of seed layer in the via of Cu/low-k multilevel interconnects ,after the irradiation of visible light,UV light,and E-beam. In the past , the via filling by...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29342367854487687615 |