A Study of Weibull Analysis on Ultimate Tensile Strength of Fine Copper Wires after EFO Process
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 93 === The advantages of copper wire for wire bonding are lower cost, higher strength and electrical conductivity in comparison with gold wire. Oxidation and insufficient ductility of copper wire resulted in low reliability in the copper wire bonding process, an...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51307629434372070783 |