Effect of Slurry Composition on the Electrochemical and Surface Characteristics of Cu and Ta in Chemical-Mechanical Polishing

博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 93 === Abstract   This research was to investigate and explore how the slurry composition affects the removal rate and surface roughness of copper and tantalum. This accomplished research was through the analyses of the components of the surface composition, elec...

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Bibliographic Details
Main Authors: Jui-Chin Chen, 陳瑞琴
Other Authors: W. T. Tsai
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/55548138560518093985