Fabrication Study of Various Microstructure using Monolithic Etching Process on (110) Silicon Wafer

• Main Authors: Fang-Yaung Lee, 李芳原
• Other Authors: Hsiharng Yang Reiyu Chein
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/46294074360428952035

碩士 === 國立中興大學 === 精密工程研究所 === 93 === In this research, a novel method to fabricate microstructures on <110>silicon wafer were proposed. A precise bulk etching micro-fabrication processes are to carry out three microstructure fabrications. This process includes depositing 1μm thermal oxide on polished wafer as an etching mask and a protection layer. The microstructures were fabricated based on special design of mask and (110) crystal orientation. The microstructures fabricated included straight side walled micro-channel heat sinks, three-dimensional hexagonal-like fillister structures and special micro-channel with microstructure distributed on the bottom wall. Three sizes of micro-channel were fabricated with highest aspect-ratio of 11. The three-dimensional hexagonal-like structures were fabricated to understand crystal distribution on (110) silicon wafer and design requirement of mask. It consists of six {111} crystal surfaces. The special micro-channel includes three-dimensional hexagonal-like structures distributed on the channel bottom layers. In order to improve the smoothness of the etched surface, the ultrasonic stirring on etchant was employed instead of traditional magnetic stirring. It was found the smoothness was improved significantly.