A study on wire-bonding parameters optimization and yield improvement for silicon rectification diode

碩士 === 義守大學 === 工業工程與管理學系碩士班 === 93 === In order to deal with the fast change of outside environment and the strong challenge of competition from globalization, enterprises need to search better ways for their production processes and remain the competitive advantage. Since semiconductor industry is...

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Bibliographic Details
Main Authors: Yu-wei Cheng, 程育維
Other Authors: Yu-min Chiang
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/00699557572987602111