Signal Integrity of High-Speed Printed Circuit Board
碩士 === 輔仁大學 === 電子工程學系 === 93 === Experimental results of interconnect parameters on an 14 layer test-board corroborate those measured with a precision impedance analyzer. In the paper a SPICE model is employed to examine the impedance of a typical signal bus on a multilayer PCB. The technique is va...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89646683090078136105 |