Improving IC packaging process—Design of Experiments on Photo Device IC(PDIC)
碩士 === 朝陽科技大學 === 工業工程與管理系碩士班 === 93 === Due to the trend of shorten electronic products’ life cycle, the pressure of the new product’s time-to-market on R&D engineers increase rapidly. Therefore, how to shorten the time between product pilot run and mass production, and thus getting more marke...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73703716126726179939 |