Advanced Process Control of Metal Sputter Deposition Using Time Series Analysis

碩士 === 中華大學 === 機械與航太工程研究所 === 93 === In this study, we propose a new method to forecast and control the deposition rate of the sputter process by the time series analysis. In order to let the process model consist with the real process anytime, the time series model is fitted by the history data of...

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Bibliographic Details
Main Authors: Tin-Chi Chen, 陳亭棋
Other Authors: Juhn-Horng Chen
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/02207222123974896201