Finite Element Study of Intermetallic Compounds on the Fatigue Life of Solder Joints for Electronic Packages under Thermal Cycles Tests
碩士 === 中華大學 === 機械與航太工程研究所 === 93 === An analysis procedure will be developed in this thesis to study the effect of thickness of the intermetallic compound on the fatigue life of solder balls for flip-chip plastic ball grid array packages under the thermal cycling test condition. In the analysis, th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99004813072915854483 |