Modified Removal Thickness Model Based Exponentially Weighted Moving Average (EWMA)Control for CMP Process
碩士 === 長庚大學 === 化工與材料工程研究所 === 93 === In semiconductor manufacturing, chemical mechanical polishing (CMP) is the key technology to carry out global planarization at integrated circuit. In CMP, lots of factors result in process variations. Therefore, how to effectively decrease or eliminate the varia...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20800290800593876423 |