Warpage and Stress Analysis of μBGA
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 92 === Micro Ball Grid Array (μBGA) is an advanced chip scale package, the I /O ports located near the die center, so the trace is short and the electrical performance is excellent. The upper and lower molding compound are distributed unequally between the substrate....
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/26165441275682200764 |