The Thermal and Mold Flow Analysis of Chip Scale Packages
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 92 === In this research, the C-MOLD and Moldflow software are used to simulate the wire sweep of both TSOP and μBGA packages during encapsulation, the predicted results are compared with experimental measurements to verify the accuracy of simulations. The effect of t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96695215996849611283 |