The 1.8~1.6nm Gate Dielectrics Prepared by Plasma-Nitridation for 0.13um CMOS Technology Application and Beyond

碩士 === 國立臺北科技大學 === 機電整合研究所 === 92 === In order to improve the device performance, gate oxide has been scaled aggressively. The gate leakage current through the gate oxide increases significantly because direct tunneling is the primary conduction mechanism. The high gate leakage increases...

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Bibliographic Details
Main Authors: Pan, Chun-Peng, 潘俊澎
Other Authors: Huang, Heng-Sheng
Format: Others
Language:en_US
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/48938724714296935755