Studies and Characterization of Porous Ultra-low Dielectric Constant Materials with Wet Ammonia Treatment

碩士 === 國立臺北科技大學 === 有機高分子研究所 === 92 === Porous XLK film Solution was supplied by Dow Corning Corp. The thin films were processed by spin coating of the solution onto a silicon wafer, treating the as-spun film with wet ammonia and then thermally curing the film. We could effectively impr...

Full description

Bibliographic Details
Main Authors: kuey-ming peng, 彭桂銘
Other Authors: Yao-yi Cheng
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/34169347096797176690

Similar Items