Studies and Characterization of Porous Ultra-low Dielectric Constant Materials with Wet Ammonia Treatment
碩士 === 國立臺北科技大學 === 有機高分子研究所 === 92 === Porous XLK film Solution was supplied by Dow Corning Corp. The thin films were processed by spin coating of the solution onto a silicon wafer, treating the as-spun film with wet ammonia and then thermally curing the film. We could effectively impr...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2004
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Online Access: | http://ndltd.ncl.edu.tw/handle/34169347096797176690 |