Studies and Characterization of Porous Ultra-low Dielectric Constant Materials with Wet Ammonia Treatment
碩士 === 國立臺北科技大學 === 有機高分子研究所 === 92 === Porous XLK film Solution was supplied by Dow Corning Corp. The thin films were processed by spin coating of the solution onto a silicon wafer, treating the as-spun film with wet ammonia and then thermally curing the film. We could effectively impr...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34169347096797176690 |
| Summary: | 碩士 === 國立臺北科技大學 === 有機高分子研究所 === 92 === Porous XLK film Solution was supplied by Dow Corning Corp. The thin films were processed by spin coating of the solution onto a silicon wafer, treating the as-spun film with wet ammonia and then thermally curing the film. We could effectively improve not only the electrical properties of the mechanical strength and moisture uptake characteristics. The properties of XLK film have been studied using capacitance voltage （C-V），current voltage analyzer （I-V），Fourier Transform Infrared spectroscope（FT-IR），n ＆ k analyzer ，Scanning Electron Microscope（SEM），Transmission Electron Microscope（TEM），Nano-indenter，Thermal Desorption System Atmospheric Pressure Ionization Mass Spectrometer (TDS-APIMS) and Atomic Force Microscope（AFM）.
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