Properties of Low-k Porous Hydrogen Silsesquioxane

碩士 === 國立臺北科技大學 === 有機高分子研究所 === 92 === As the dimension of IC devices continues to shrink, RC time delay becomes more important. Therefore, it is necessary to use low-dielectric-constant (low-k) materials to reduce the capacitance between the metal interconnection. This paper presents study on poro...

Full description

Bibliographic Details
Main Authors: Chanug-Chih Chang, 張仲志
Other Authors: Yao-Yi Cheng
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/86096269972281267691