A Study of High Frequency Based Rapid and Locally Selective Anodic Bonding

• Main Authors: Chia-Der Chu, 褚家德
• Other Authors: Ching-Kong Chen
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/91742825812338718759

碩士 === 國立臺北科技大學 === 自動化科技研究所 === 92 === Anodic bonding is one kind of the common and useful bonding method in MEMS process. This study provided a new method to assist anodic bonding by induction heating. By electromagnetic radiation, the area of magnetic material can be rapidly heated. Besides the advantage of induction heating, we can control the contact area to make the bond occurred at which we want. In this way, it can achieve the purpose of locally selective anodic bonding. It is not good for some MEMS-device to expose under high temperature for a long time by traditional anodic bonding process. We present a new method of high frequency induction heating to improve the defect. The block of magnetic material is made to be the source and electrode such that the rapid bond is completed in 10 minutes. Furthermore, the locally selective anodic bonding is developed by controlling the bonding temperature. A micro scale cover was made and applied to the MEMS switch by locally selective anodic bonding to confirm the feasibility of the new method.