Effects of Sodium Thiosulfate on Electroless Copper Deposition
碩士 === 國立臺北科技大學 === 化學工程系碩士班 === 92 === Recently copper has been used to replace Al metallization in ultra large scale integrated (ULSI) technology because of low resistivity and stress-induced voiding. Copper can be deposited by physical vapor deposition, thermal-induced reflow, chemical vapor depo...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48171959008309379791 |