Study of Working Mechanism on Electroplating Copper Metallization of ULSI with Ultrasonic Irradiation
碩士 === 南台科技大學 === 化學工程系 === 92 === Electroplating is a major method for IC interconnection metallic process. The electroplating method has some advantages of low cost, low toxicant, high deposition rate, high quality of the copper film morphology and simple operation system, but the major disadvanta...
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| Format: | Others |
| Language: | zh-TW |
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2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39908940637516691588 |