Improve Passive Alignment Optical Sub-Assembly System Package Using Flip Chip Technique

• Main Authors: Kuo-Hui Yang, 楊國煇
• Other Authors: Jeng-Ywan Jeng
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/94652387895568671247

碩士 === 國立臺灣科技大學 === 機械工程系 === 92 === This study is aimed to use a general solder in optical communication sub-assembly package. The problems of the semiconductor laser and semiconductor optical amplifier package are the positioning control accuracy and the solder overflow. The self-alignment advantage of flip chip bonding has been employed to improve the reliability of height and position. The Pb-free solder and electroplate technique were employed in this research to replace the usage of Cu-Sn to avoid the pollution problem. In the passive alignment of optical sub-assembly, Si etching becomes an important method. This research includes the fabrication of single V-Groove and several V-Grooves average. The precision of V-Groove fabrication, the precision can be controlled into 2μm.Further, the radiate area form of semiconductor laser lead the light field dissymmetry and unable coupling in fiber completely. Usually, the lenses fiber was fabricated by chemical etching method. This method is improved to obtain developed potential multi-taper than one taper fiber and prove chemical etch method is changefully.