Improve Passive Alignment Optical Sub-Assembly System Package Using Flip Chip Technique
碩士 === 國立臺灣科技大學 === 機械工程系 === 92 === This study is aimed to use a general solder in optical communication sub-assembly package. The problems of the semiconductor laser and semiconductor optical amplifier package are the positioning control accuracy and the solder overflow. The self-alignment advanta...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94652387895568671247 |