An Automatic AMBA Wrapper Generation Tool for Embedded Cores

碩士 === 國立清華大學 === 電機工程學系 === 92 === As the time-to-market pressure and system-on-chip (SOC) device complexity keeps increasing, reusing complex building blocks or Intellectual Property (IP) forces the designers to face the problem of integration. There are many problems involving in SOC design and t...

Full description

Bibliographic Details
Main Authors: Ming-Shen Liu, 劉明珅
Other Authors: Cheng-Wen Wu
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/49250004246958559659