Interfacial Reactions and Compound Formation of Sn-Ag-Cu Solders by Mechanical Alloying on Electroless Ni-P/Cu UBM
碩士 === 國立清華大學 === 材料科學工程學系 === 92 === Mechanical alloying (MA) process is considered as an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1 wt.%) solder by mechanical alloying (MA) was investigated. (Cu, Sn...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/xhv3y9 |