Fabrication and simulation of passive integrated devices (inductors) using thin film technology
碩士 === 國立清華大學 === 材料科學工程學系 === 92 === High operation frequency, miniaturization, functionality, and reliability are the trends of future wireless and portable communication productions. Circuit integration becomes essential for the development. The shrinking and integration capability of active devi...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2004
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Online Access: | http://ndltd.ncl.edu.tw/handle/ug3f9n |