A Study Of Technology Transfer Mechanism For IC Packing Process
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === The current packaging trend toward smaller and thinner package has pushed the manufacturing technology to the limit. Due to fast development of encapsulation technology, the need for shortening factory time and upgrading technological ability are vital to...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77102061720626710693 |