Fatigue Lifes of Sn/Pb and Sn/Ag/Cu Solder Balls

Fatigue Lifes of Sn/Pb and Sn/Ag/Cu Solder Balls

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === The Coffin-Manson equations of Sn/Ag/Cu and Sn/Pb solder joints are presented in this thesis. The experimental results of CSP thermal cycle fatigue test and ball shear test are used to formulate Coffin-Manson equations. The maximum amplitude of equivalent pl...

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Bibliographic Details
Main Authors:	Cheng-Hua Wu, 吳政樺
Other Authors:	Jao-Hwa Kuang
Format:	Others
Language:	zh-TW
Published:	2004
Online Access:	http://ndltd.ncl.edu.tw/handle/65115125208576120499

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