Fatigue Lifes of Sn/Pb and Sn/Ag/Cu Solder Balls
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === The Coffin-Manson equations of Sn/Ag/Cu and Sn/Pb solder joints are presented in this thesis. The experimental results of CSP thermal cycle fatigue test and ball shear test are used to formulate Coffin-Manson equations. The maximum amplitude of equivalent pl...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65115125208576120499 |