The Study of Thermo-mechanical Behavior of PBGA Package''s Interface
博士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === The Plastic Ball Grid Array (PBGA) package and flip-chip technology have been widely used in the microelectronics industry. However, due to the effect of hygroscopic and thermal stresses, the reliability is still of concern during manufacturing and operation...
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| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65963013642840845489 |