| Summary: | 碩士 === 國立交通大學 === 機械工程系所 === 92 === The Transformer-Coupled-Plasma is one of the most important and commonly used etching equipment in chip foundry today. In this research, we employ the software “Microsoft Visual Basic” in the computer to construct a basic two dimensional fluid model of TCP (Transformer-Coupled-Plasma) etching equipment, which is made in a User-Interface mode .By the support of this basic TCP model, we can change several major input parameters to observe the variation in the plasma chamber, and go on to add the concept of Run-to Run plasma etching equipment control using this model. After that, we can reduce the source power to get better plasma density distribution in the chamber, even more to improve the wafer etching rate .Form this research, we also recommend a new idea to improve the wafer etching uniformity, for the purpose of enhancing application and development of plasma etching equipment in the front end of wafer processing line.
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