Effects of Plasma Substrate Treatment on on Cu-CVD
碩士 === 國立交通大學 === 電子工程系所 === 92 === Abstract This thesis studies the copper chemical vapor deposition (Cu CVD) on TaN and TaSiN substrates as well as the effects of substrate plasma treatment (by Ar-, H2-, or N2-plasma) on the Cu nucleation and the Cu films property. The Cu CVD was performed usi...
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| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4s6t64 |