A Study of the Fabrication of Flip-Chip Bumps Using Dry-film Photoresist Process on 300mm wafer
碩士 === 國立交通大學 === 產業安全與防災學程碩士班 === 92 === This work is to study the dry-film photoresist to form patterns for Flip-Chip bumps on 300 mm wafers. The so-called “double-deck metal seed layer” process was also applied in this study by using sputtered 1000 Å Ti (Titanium) and 5000 Å Cu (Copper) metal lay...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87486195800216197288 |