Stress Singularity and Fracture Analyses in the FlipChip Assembly
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 92 === In this paper, we analyze the behavior of stress singularities and obtain numerically the stress intensity factors near the geometric and material discontinuities of the flip chip assembly. The governing factors that affect the failure probability include the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42419115993005909654 |