The Study of MEMS Probes for High-Speed, High-Frequency, and High-Parallel Wafer-Level Testing
碩士 === 國立成功大學 === 微電子工程研究所碩博士班 === 92 === The current trend is towards device miniaturization. In other words, there will be placed more devices in the same area. Besides, the current trend is towards high frequency. In the process of wafer-level testing, we can find the tarnish from these small a...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16473957322483328268 |