Investigations on Flip Chip Solder Bump and Under Bump Metal
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 92 === Interactions between under bump metal and solder will affect the material property of solder bump. Therefore, the design and manufacturing of the UBM and solder bump should be conducted carefully. Amorphous Cu1-xTax and a new structure of under bump metal...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69863201748334421890 |