A study of thermal performance of the liquid cooling modules
碩士 === 國立成功大學 === 工程科學系碩博士班 === 92 === With the development of semiconductor manufacturing technology, the power dissipation of the microprocessor raises. Conventional cooling-by-air methods will be limited when the power dissipation increases. To accomplish high power dissipation, small liquid co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/5964ar |