Impact Effect on Strength of Gold Wire Loops

• Main Authors: Chung-Hao Lee, 李崇豪
• Other Authors: Huei-Huang Lee
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/9sk4w9

碩士 === 國立成功大學 === 工程科學系專班 === 92 === 　　The wire damage problem after wire bonding process for TSOP product is one of the major factors to affect testing yield. This phenomenon is more significant as the wire length increases and lead width decreases in TSOP multi-chip package. 　　In this paper, a three-dimensional model is used for the simulation of the impact damage of wire loop. On the impact moment, the tensile stress on heat-affected-zone of gold wire loop of TSOP IC package is analyzed by using the ANSYS. 　　In the loop simulation for improvement, looping condition, fixed such as wire diameter, lead length, and heat-affected-zone. Various conditions such as loop height, wire length, and top length ratio of square loop were investigated on the improvement of wire damage. Then apply Taguchi Methods in order to find an optimal looping condition. Finally, using the analysis of variance to find out the major factors and select an optimal looping condition for production. 　　Through the ANSYS and Taguchi Method in this paper, package designer can do a better design for process impact problem improvement before production.