Impact Effect on Strength of Gold Wire Loops
碩士 === 國立成功大學 === 工程科學系專班 === 92 === The wire damage problem after wire bonding process for TSOP product is one of the major factors to affect testing yield. This phenomenon is more significant as the wire length increases and lead width decreases in TSOP multi-chip package. In this paper, a th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9sk4w9 |