| Summary: | 碩士 === 國立成功大學 === 工程科學系碩博士班 === 92 === This thesis discuss the behaviors(shear strain, shear stress) with various solder joints in different temperature which applied with deformation kinetic(Valanis and Lee,1981).
Solder Joints,90Pb-10Sn ,63Sn-37Pb ,were tested with double beam specimens ,and solder joints Sn, Sn-3.5Ag, Sn-0.7Cu, Sn-3Ag-0.5Cu, and Sn-10In-3.1Ag were tested with simple shear test specimens.
I changed the parameters of solder joint specimens step by step to find the optimal values. There are some different parameter values between Bulk specimens and solder joint specimens. At first, I Defined the parameter k1, and then k1 or cutoff shear stress.change with temperature.
To Analysis the creep behaviors among those solder joints must be with the parameters k1 and the slop of energy barrier . By the way, I found the parameter the slop of energy barrier of Sn-10In-3.1Ag which was much different about another solder joints.
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