Steady Creep Analysis of Lead/Lead Free Solder Joints Using Deformation Kinetics
碩士 === 國立成功大學 === 工程科學系碩博士班 === 92 === This thesis discuss the behaviors(shear strain, shear stress) with various solder joints in different temperature which applied with deformation kinetic(Valanis and Lee,1981). Solder Joints,90Pb-10Sn ,63Sn-37Pb ,were tested with double beam specimens ,and...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/bhyp37 |