The Investigation of Die Bond Process in Stacked Die Program

• Main Authors: Kuo-Yang Sun, 孫國洋
• Other Authors: Pei-Chieh Chin
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/12232738606810111356

碩士 === 義守大學 === 材料科學與工程學系 === 92 === Stacked-die program is one of assembly tools in IC packaging. The purpose is to assemble dice with different or same applications into the same IC product possessing different functions or double its capacities. The first commercial stacked-die product is a CSP (Chip Scale Package) which includes Flash as well as SRAM. The current application requires to assemble Analog, Digital, and Memory dice into a single module. This investigation will introduce stacked-die series as well as compare manufacturing processes. The effect of material on reliability and process will be addressed and the solution will be presented. Based on the experimental results, the success of making stacked-die module will depend on both the process and epoxy. The correctly chosen epoxy can prevent die from crack and failure. With the precise bond-line thickness, the yield of stacked-die module would be more steady. The contribution of this investigation is using epoxy instead of spacer to reduce output time, cost of products, and to maximize yield at the same time. Key Word：Stacked Die Program；Stacked Die；Die Attach；Analog；Digit； Bond Line Thickness