The Investigation of Die Bond Process in Stacked Die Program
碩士 === 義守大學 === 材料科學與工程學系 === 92 === Stacked-die program is one of assembly tools in IC packaging. The purpose is to assemble dice with different or same applications into the same IC product possessing different functions or double its capacities. The first commercial stacked-die product is a CSP (...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12232738606810111356 |