The Research of Lead-Free Solder Interfacial Reaction in UCSP Package
碩士 === 義守大學 === 材料科學與工程學系 === 92 === In this research, the basic properties、microstructures and the aging effects of Sn-0.7Cu、Sn-2.6Ag-0.6Cu、Sn-4.0Ag-0.5Cu lead-free solder balls and conventional Sn-Pb solder ball are investigated. In addition, commercial Ultra CSP 98L device with above mentimed sol...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66308816564115066870 |