Thermal-Mechanical Analysis of Chip-on-Glass Electronic Packaging
碩士 === 逢甲大學 === 航空工程所 === 92 === Nowadays, the favor of electronic devices with diverse functions, portability and very high performance has pushed the design of IC packages to a new era with higher I/O densities, smaller packaging size, and faster operation frequency. The chip-on-glass (COG) te...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60183020225977678456 |