Thermal Optimal Design of Chip Placement for Planar Multichip Modules
碩士 === 逢甲大學 === 航空工程所 === 92 === As the product’s form factor continues decrease while the number of chips keeps on rising, the power densities in MCMs become dramatically increasing. This would lead to a higher temperature field that would generally result in high stress and eventually lower the fa...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72330977242346519647 |